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ABB 3BHB003387R0101 (5SXE 05-0151)

使用方法：不依赖外部电源，通过CT电路供电，适用于无辅助电源的配电盘。
发货时间：库存现货质保一年
付款方式：SWIFT C/*C 对公对私
原产地：USA
联系方式：+8615359029662
销售范围：全球 all over the world
用途：提供定时限和反时限跳闸特性，用户可根据需求选择。具备接地故障保护功能，支持两级接地故障监控（IE, IE>>）。

手机：+86 153 5902 9662 邮箱：geabbamy@gmail.com

产品详情

Technical Parameters of ABB 3BHB003387R0101 (5SXE 05-0151) Printed Circuit Board (PCB)

1. General Overview

The ABB 3BHB003387R0101 (5SXE 05-0151) is a specialized printed circuit board (PCB) designed for industrial automation, power electronics, and control systems. It is typically integrated into ABB’s high-performance drives, such as DC converters, IGCT-based power modules, or motor control units, ensuring reliable signal routing, power distribution, and component interconnection.

2. Key Technical Specifications

Parameter	Details
Model/Part No.	3BHB003387R0101 (5SXE 05-0151)
Function	- Core PCB for IGCT (Integrated Gate-Commutated Thyristor) modules - Supports high-voltage/high-current switching in power electronics - Enables gate driver integration and signal conditioning
PCB Layer Configuration	Multi-layer PCB (6-8 layers) with high-density interconnect (HDI) for thermal and electrical efficiency
Materials	- Base material: FR-4 (Flame Retardant 4) for mechanical stability - Copper thickness: 2 oz (70 µm) for high-current paths
Dimensions (Approx.)	150 mm × 120 mm × 2.0 mm (subject to configuration)
Operating Voltage	Up to 6.5 kV DC (for IGCT modules) Control voltage: 24 VDC ±10%
Current Rating	Up to 3 kA (peak) for power circuits Signal circuits: 0.5 A max.
Thermal Management	- Thermal via arrays for efficient heat dissipation - Gold-plated pads for improved solderability and oxidation resistance
Connectivity	- Edge connectors for power and control signals - High-density pin headers for auxiliary interfaces
Environmental Compliance	RoHS-compliant, REACH-ready, UL 94V-0 flame rating
Protection Class	IP20 (standard); can be upgraded for higher IP ratings if housed
Operating Temperature	-40°C to +85°C (industrial-grade components)
Storage Temperature	-55°C to +125°C
Humidity Tolerance	5% to 95% RH (non-condensing)

3. Advanced Features

High-Speed Signal Routing: Supports fast switching frequencies (up to 10 kHz) for IGCTs.
Isolated Power Planes: Separate power and control layers to minimize noise.
EMI/RFI Shielding: Integrated ground planes and guard traces for electromagnetic compatibility.
Component Integration:
- IGCT drivers (e.g., ABB’s proprietary drivers for 5SHX series IGCTs).
- Voltage regulators, op-amps, and level shifters for signal conditioning.
- Protection diodes, transistors, and resistors for fault handling.
Test Points & Debugging: On-board test points for voltage/current monitoring and fault diagnosis.

4. Application Areas

HVDC (High-Voltage Direct Current) transmission systems
Industrial drives (e.g., ABB ACS880, DCS800 series)
Renewable energy (wind turbines, solar inverters)
Rail traction systems (electric locomotives, metros)
Oil & gas (drilling rigs, pump drives)

5. Compliance & Certifications

IEC 61800-3 (Adjustable speed electrical power drive systems)
IEC 60146-1-1 (Semiconductor converters)
UL 508C (Power conversion equipment)
CE Marking (EMC, Low Voltage Directive)

6. Mechanical & Mounting Details

Mounting: Through-hole (THT) and SMD (Surface Mount Device) components for mixed assembly.
Fixing Holes: M3 screw holes for chassis mounting.
Conformal Coating: Optional for corrosive/humid environments.

7. Warranty & Support

Standard Warranty: 1 year (extendable via ABB service contracts).
Recommended Spare Part: Yes (critical for downtime reduction).

8. Replacement & Cross-Reference Notes

Supersedes Older Models: May ｒｅｐｌａｃｅ 3BHB003387R0001, 3BHB003387R0002 (check firmware compatibility).
Compatible with: 5SHX series IGCTs (e.g., 5SHX08F4502, 5SHX1060H0003).

Notes for Users

Installation: Requires qualified personnel due to high-voltage risks.
Maintenance: Regular thermal imaging checks recommended for power layers.
Firmware Updates: Ensure PCB firmware matches the control system version (via ABB Ability™).

Would you like additional details on IGCT integration, thermal design, or customization options?

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